Double group division thermal gel HR-ST0035

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        Product description      

The HR-S series is a soft dual-group silicon resin base thermal seam filling material, which includes 5 products with a thermal conductivity 1.5 ~ 6.5W/(M.K), which has high heating rate, low interface thermal resistance and good touch. Transsexuality is an ideal material for the application of large gaps.

The HR-S series dual-component heat-conducting gel is widely used in the fields of communication equipment, power batteries, energy storage batteries, consumer electronics and other fields. It has the functions of heat -conducting, insulation, adhesion, and sealing; adapting to automated production lines and improving work efficiency.

       Product characteristics and advantages   

■ Thermal conductivity 1.5 ~ 6.5W/(m.k)

■ The breakdown strength ≥10kV/mm, the typical value can reach 20 kV/mm

■Flame retardant UL 94-VO

■ Have a certain adhesion, and the removable and repurchase

■ Suitable for spotting machine, automated point glue production line, higher work effect

        Product Usage      

The HR-S series dual-group thermal conductivity is suitable for interface thermal conductivity in various electronic components. Among them -St0050, HR-ST0065 specially apply 5G chips, vehicle navigation, drones, aerospace, laptops and desktop computers, mobile chips, audio and video equipment, automotive systems, communication equipment, consumer electronics and other fields.

        包装和储存      

■ Packaging: It contains three packaging specifications: 2*25ml, 2*200ml, and 2*20L. The non -standard packaging required by the customer is executed according to the contract.

■ Warehouse environment: storage temperature should be ≤35 ° C, relative humidity ≤70%, seal storage period 6 months

■ During the transportation process: the maximum transportation temperature should be less than 45 ° C, and the relative humidity of the maximum storage and transportation should be less than 95%

      Precautions      

Store in ventilation, cool, dry, do not touch the fire. This product is non -toxic and is stored and transported by non -dangerous goods.

After long -term storage, the fillers in the glue will settle down. Please use it evenly without affecting performance.

The organic compounds of P (phosphorus), S (sulfur), and N (nitrogen) elements in this product are "toxic" and affect the solidification effect. Pay attention to cleaning during use to prevent impurities from mixing.

The contact of the following chemicals will not solidify the HR-SV series: SN, PB, HG, AS plasma sexual compounds, P (phosphorus), S (sulfur), N (nitrogen) elements; Essence

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