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The advantages and disadvantages of epoxy resin irrigation and sealing glue:

Advantages: Most of the epoxy resin irrigation and sealing glue is mostly hard, and there are very few modified moving epoxy resin slightly soft. The greater advantage of this material is that the bonding of the material is better and good insulatability, and the solidary and alkali resistance is good. Materials can be used as transparent materials and have good light transmittance. The price is relatively cheap.

Disadvantages: The ability to resist cold and cold is weak. After being hit by hot and cold, it is easy to cause cracks, which causes water vapor to seep from the crack to electronic components. The moisture -proof ability is poor; Easy to strain electronic components; once the epoxy resin is unable to open it because of the high hardness after being irrigated and solidified, the product is "lifelong" product, which cannot be replaced by components; Yellow changes are prone to light or high temperature conditions.

Scope of application: generally used for sealing of non -precision electronic devices such as LED, transformers, regulators, industrial electronics, relays, controllers, power modules, etc.

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